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www.hesse-knipps.com
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The company Hesse & Knipps develops and delivers equipment for semiconductor backend assembly;
the spectrum includes:
- wire bonders,
- pick- and place machines,
- dispensers,
- flip chip bonders
All these machines have inline capability and can be equipped with a range of different standardised or customized Handling- and Lift- systems. AÊPC based "process data control system" can track the wanted information of up to 50 machines and systems. It can archive and analyse data and communicate with other systems like SAP.
Since 1986 this company was mainly working in the field of industry automation. In 1995 Hesse &ÊKnipps started to build and sell High Tech equipment for semiconductor industry. The headquarters are located in Paderborn, Germany. A worldwide customer base is served either directly from Germany or by Sales- and Service-Partners. |
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