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SUMMARY:SMTA-Wafer Level Packaging
DESCRIPTION:Where: Hyatt Regency San Francisco Airport\n1333 Bayshore Highway\nBurlingame\, California 94010 \nThe development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements\, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results. Say hi to our JH Team!\nREGISTER HERE
URL:https://www.jhtechnologies.com/event/smta-wafer-level-packaging/
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SUMMARY:TSM- Texas Society for Microscopy
DESCRIPTION:Dates: February 19 & 20\, 2026\nLocation: University of Texas at Austin; Peter O’Donnell building (POB) \nThe 60th Anniversary TSM Meeting\, hosted by the University of Texas at Austin\, will take place on February 19 & 20\, 2026. This annual event brings together experts and enthusiasts in microscopy to share knowledge\, showcase the latest advancements\, and network with peers. Say Hi to our JH Team! \nREGISTER HERE
URL:https://www.jhtechnologies.com/event/tsm-texas-society-for-microscopy/
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