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X-WR-CALDESC:Events for JH Technologies
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SUMMARY:MD&M West 2026
DESCRIPTION:Explore the MedTech Sector at MD&M West—where safety\, precision\, and performance define every innovation. From essential components and breakthrough technologies to the industries driving MedTech forward\, this is the hub to connect with top suppliers\, discover new solutions\, and tackle your toughest medical device challenges. Meet the professionals shaping the future of healthcare\, learn from expert-led education\, and see how MedTech integrates with other advanced manufacturing sectors\, all under one roof. \nSay Hi to the JH Team at the Leica\, Sensofar and Xavis booth! \nREGISTER HERE
URL:https://www.jhtechnologies.com/event/mdm-west-2026/
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DTSTART;TZID=America/Los_Angeles:20260211T100000
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UID:13626-1770804000-1770829200@www.jhtechnologies.com
SUMMARY:Equipment Showcase Event: UC Santa Barbara — Register Now
DESCRIPTION:Date and time: Feb 11\, 2026 – 10AM – 5PM\n\n\n\n\nLocation: University of California\, Santa Barbara\, CNSI Elings Hall\, room 1605\n\n\nWe’re heading to UC Santa Barbara for an on-site JH Technologies Equipment Showcase\, featuring live demonstrations and expert discussions. \nFeatured Equipment:\n• Sensofar S Lynx Optical Profiler• Coxem EM-40 Tabletop SEM• Leica Microscopes• Xavis X-ray Inspection Demo• CSI AFM Solutions \nThis is a great opportunity to see multiple technologies in action and discuss real-world applications with our team. \n REGISTER HERE
URL:https://www.jhtechnologies.com/event/roadshow-event-uc-santa-barbara-register-now/
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DTSTART;TZID=America/Los_Angeles:20260217T080000
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DTSTAMP:20251218T234008Z
CREATED:20251218T234008Z
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UID:13579-1771315200-1771520400@www.jhtechnologies.com
SUMMARY:SMTA-Wafer Level Packaging
DESCRIPTION:Where: Hyatt Regency San Francisco Airport\n1333 Bayshore Highway\nBurlingame\, California 94010 \nThe development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements\, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results. Say hi to our JH Team!\nREGISTER HERE
URL:https://www.jhtechnologies.com/event/smta-wafer-level-packaging/
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DTSTART;TZID=America/Los_Angeles:20260219T080000
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DTSTAMP:20251218T232730Z
CREATED:20250219T232523Z
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UID:13573-1771488000-1771606800@www.jhtechnologies.com
SUMMARY:TSM- Texas Society for Microscopy
DESCRIPTION:Dates: February 19 & 20\, 2026\nLocation: University of Texas at Austin; Peter O’Donnell building (POB) \nThe 60th Anniversary TSM Meeting\, hosted by the University of Texas at Austin\, will take place on February 19 & 20\, 2026. This annual event brings together experts and enthusiasts in microscopy to share knowledge\, showcase the latest advancements\, and network with peers. Say Hi to our JH Team! \nREGISTER HERE
URL:https://www.jhtechnologies.com/event/tsm-texas-society-for-microscopy/
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