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Bond

William Bond

Lab Engineer

"My product at JH is the Leica EM TIC 3X. I have been working with this ion mill for over 4 years and it's one of the most useful tools for EM sample preparation."  

Joined JH Technologies in 2022

Willliam likes the combination of a services lab as part of a distributor as it provides a unique opportunity to work with the newest equipment to provide top-of-the-line analysis.

He also enjoyed working with the semiconductor tool industry as the customers and projects he has worked on are seeing real-world effects. It also provided him the opportunity to learn more about the industry that is vital to Silicon Valley.

William looks forward to being at JH and is excited to continue learning, and expanding his knowledge by working with new customers and ever-changing samples. He has been working in this job field for over 6 years now, William graduated from San Jose State University with a BS in Mechanical Engineering.