• Principles of Cross Section Polisher

When a voltage is applied to the ion gun and it injected argon gas, plasma is generated and an acceleration voltage directs at the sample an ion beam to begin the etching process. If the sample is behind a metal mask and it direct the ion beam at the metal mask and sample, the shielding effect of the metal mask minimizes beam damage to get a clean cross-sectional etching results.

• Digital Microscope

Using a digital microscope, it can easily align the position of the ion beam and the position of the sample through the screen

• Chamber Camera

You can check the status of the ion beam through the camera inside the chamber and check the degree of cross-sectional etching in real-time

• Auto beam ON/OFF mode

You can check the status of the ion beam through the camera inside the chamber and check the degree of cross-sectional etching in real-time

• Recipe Mode

Frequently used etching conditions can be stored in the recipe list to easily apply setting values whenever necessary. In addition, a step-by-step mode is also available to store several recipes and automatically execute them to etch samples.

• Flat Milling

The CP-8000+ can process samples in a plane using a dedicated holder. When a sample is mounted in the dedicated holder and the flat milling function is used, the ion beam based on the rotation center axis etches several mm2 areas. Since the polishing speed, area, and depth vary depending on the angle of incidence at which the ion beam hits the sample surface, uniform surface polishing should be induced by rotating and adjusting the angle of the sample. As the ion beam irradiates a larger area to etch an oxide layer or foreign substance, it is useful for the pre-treatment of a large area of the sample.