SMTA-Wafer Level Packaging
February 17, 2026 @ 8:00 am - February 19, 2026 @ 5:00 pm

Where: Hyatt Regency San Francisco Airport
1333 Bayshore Highway
Burlingame, California 94010
The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results. Say hi to our JH Team!