Sample Preparation for Material Analysis
The basic process of mechanical specimen preparation is material removal using abrasive particles in successively finer steps, to remove material from the surface until the required result is reached. There are three mechanisms of removing material: grinding, polishing, and lapping.
In a typical example, cross-section or micro-section analysis of a PCB is a destructive analysis that measures the quality of the manufactured board. It’s an interconnection defect analysis process that detects and verifies what went wrong inside the PCB. This is an integral part of the PCB manufacturing process.
Samples are usually mounted in epoxy “pucks” to maintain the samples’ integrity while processing.
A similar process is used for checking the quality of raw materials, welds, 3D printed additive manufactured products, medical devices, etc.
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