Leica EM TXP Target Preparation for Electron Microscopy

A versatile target preparation device for microscopy. Combining milling, sawing, grinding, and polishing capabilities with an integrated stereomicroscope, makes the EM TXP an efficient tool for preparing samples for SEM, TEM, and LM examinations.

Features

  • The system’s innovative features enhance precision and streamline the sample preparation workflow

  • Multi-functional preparation capabilities:
    • Milling, sawing, grinding, and polishing
    • Various tool inserts for different techniques
  • Integrated stereomicroscope:
    • Allows direct observation of barely visible targets
    • Enables distance determination with eyepiece graticule
  •  Adjustable specimen pivot arm:
    • Observation angles between 0° and 60°, or 90° to the front face
  • Automated process control:
    • E-W guiding mechanism
    • Force-regulated feed control
    • Countdown function
Leica EM TXP Target Surfacing System
Leica EM TXP

Benefits

PCB Micro Sectioning
  • Enhanced Precision: Direct sample observation for faster, more accurate targeting.
  • Improved Efficiency: Eliminates sample transfers, speeding up preparation.
  • Versatility: Multiple preparation methods in one instrument.
  • Cost-effective: Saves time and reduces reliance on multiple tools.
  • Workflow Optimization: Streamlined quality control with Leica system integration.
  • User-friendly: Automation minimizes manual intervention.
EM TXP side view
EM TXP sawing/sectioning
EM TXP Sectioning microchip
EM TXP polishing
TXP completed section
TXP completed cross-section SEM image

Specifications

Videos

Downloads

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