Electron Microscopy Sample Preparation Systems

EM Sample Preparation Systems — High-quality electron microscopy (EM) starts with expert EM sample preparation. Whether you're preparing samples for SEM, TEM, EBSD, or EDS analysis, we offer high-performance electron microscopy sample preparation equipment—including ion milling equipment, sputter coaters, vibratory polishers, and critical point dryers—to ensure accuracy, repeatability, and electron microscopy imaging clarity across a wide range of materials.

Preparing samples flawlessly is crucial for obtaining top-notch electron microscopy images. We understand the importance of meticulous EM sample preparation and offer preparation equipment

Ion Beam Milling Systems for EM Sample Prep

Ion beam milling is an advanced electron microscopy sample preparation technique used to eliminate surface damage and residual artifacts left behind by mechanical cutting and polishing. By precisely thinning and smoothing the sample surface without deformation, this non-destructive method is ideal for high-resolution electron microscopy imaging and accurate microstructural analysis.

Ion beam milling is essential for preparing samples for advanced techniques such as:

Energy Dispersive X-ray Spectroscopy (EDS)
Electron Backscatter Diffraction (EBSD)
Wavelength Dispersive Spectroscopy (WDS)
Auger Electron Spectroscopy (AES)

Sputter Coating Systems

Sample conductivity is critical for producing high-quality images in scanning electron microscopy (SEM). Non-conductive samples can develop surface charging, which degrades image resolution and contrast. To prevent this, a conductive coating is often applied to dissipate charge and stabilize the imaging process.

Sputter coating is a fast and effective method to apply an ultra-thin layer of conductive material —such as gold, platinum, or carbon—onto the sample surface. This enhances image clarity and ensures accurate analysis across a variety of SEM applications.

Freeze Fracturing, Sample Transfer, & Critical Point Drying

Preserve delicate structures and prevent preparation artifacts with advanced freeze fracturing, contamination-free transfer, and critical point drying solutions. These techniques are essential for maintaining the native morphology of sensitive biological and material samples during electron microscopy workflows.

Freeze fracturing enables detailed internal structure analysis by cleaving samples along natural planes
Contamination-free sample transfer maintains sample integrity between preparation and imaging stages
Critical point drying (CPD) eliminates surface tension effects, preventing distortion or collapse of fragile structures
Ideal for biological samples, polymers, and porous materials
Ensures artifact-free preparation for high-resolution SEM and TEM imaging

Ultramicrotomes & Cryo-Ultramicrotomes

Achieve ultra-thin, high-quality sections for transmission electron microscopy (TEM) and advanced material analysis with precision ultramicrotomy solutions. Designed for both room temperature and cryogenic applications, these systems enable consistent, reproducible sectioning of even the most challenging samples.

Ultramicrotomes produce ultra-thin sections for high-resolution TEM imaging
Cryo-ultramicrotomes preserve temperature-sensitive samples by sectioning under cryogenic conditions
Enables sectioning of soft, hard, and heterogeneous materials
Delivers smooth, deformation-free surfaces for accurate structural analysis
Supports applications in life sciences, polymers, and nanomaterials research