12/4/2025
When:	Thursday, December 4, 2025 10:00AM (US Pacific)
Where:	Online
Contact:	JH Technologies

Why Attend?
Learn how advanced EM preparation technologies are transforming micro target location, alignment, and preparation—turning complex and error-prone workflows into fast, precise, and reliable processes.
In this webinar, you will learn how to:

• Mechanically prepare micro targets using a mechanical cross-sectioning device (EM TXP), demonstrated live on a real sample
• Produce pristine surfaces through broad ion beam milling with the EM TIC 3X system
• Pre-prepare your samples more efficiently, reducing ion milling time through synergic use of the TXP-TIC 3X workflow

Preparing micro targets in microelectronics and other advanced materials systems presents a major challenge because these targets are rarely visible. As a result, pinpointing and aligning them precisely can be difficult, making preparation to the exact target a time-consuming and error-prone process where the target may easily be missed. In addition, specimens containing micro targets are typically small, fragile, and difficult to handle, further complicating the workflow.
Advanced preparation systems now make it possible to achieve precise, real-time control of micro target preparation and surface quality. The EM TXP device enables accurate in situ mechanical preparation through an integrated viewing system that enables every stage of the process to be monitored. When combined with the EM TIC 3X broad ion beam milling system, you can produce pristine, artifact-free surfaces ready for high-resolution EM analysis.
Developed by Leica Microsystems, this integrated workflow significantly simplifies the preparation of even the most challenging micro targets, saving time while improving reliability and surface quality.

Registration 

Registration for attendees is free! Included in each registration is access to the expo, technical presentations, and a complimentary lunch!