📅 Date: May 14
🎤 Speaker: Yifan Jiang
💬 Live Q&A: Yifan Jiang and Tim Schoen

In this session, Yifan will walk through real-world examples of how X-ray CT helps reveal hidden issues such as solder voids, cracks, delamination, and internal structural defects in electronic devices. Attendees will gain practical insights into how CT imaging can improve failure diagnostics, quality control, and product development.

Tim will also join the session to assist with the live Q&A, helping answer audience questions about CT workflows, applications, and best practices.

What You’ll Learn

• How X-ray CT works for non-destructive electronic inspection
• Common electronic failure modes detected with CT
• How CT reveals internal defects invisible to traditional inspection methods
• Practical examples of CT imaging in electronic failure analysis
• When CT should be used alongside other analytical techniques

This webinar is ideal for engineers, failure analysis specialists, quality engineers, and researchers working with electronic devices and assemblies.

Stay until the end for a live Q&A session where you can ask questions and discuss your specific applications with our experts.

REGISTER HERE