X-ray systems for Semiconductor
The XSCAN-H series offers three high-powered X-ray inspection systems (H130-OCT, H160-OCT, and H160M) featuring hybrid 2D/3D inspection capabilities with automation technology, designed for comprehensive electronic component inspection with tube powers ranging from 130kV/39W to 160kV/10W, incorporating advanced OCT technology for precise measurements.
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XSCAN-H series Features
Across All Models:
- Basic 7-axis control system (X1,Y1, X2, Y2, Z, T, R1)
- Large inspection area (330 x 330mm / 525 x 540mm)
- Navigation user interface with auto teaching
- Various measuring tool software
- Easy-to-use operation system
- Optional cone beam CT capability
- 5″ flat panel detector
Model-Specific Features
XSCAN-H130-OCT:
- 130kV/39W x-ray tube power
- Closed type/5ÎĽm focal spot
- 1700 x 1700 x 1800mm dimensions
- 3000kg weight
XSCAN-H160-OCT & H160M:
- 160kV/10W x-ray tube power
- Open type/1ÎĽm focal spot
- 1700 x 1700 x 2200mm dimensions
- 3400kg weight
- H160M offers image intensifier option
XSCAN-A series Benefits
Ideal for SMT assemblies inspection
Effective semiconductor component analysis
Comprehensive PCB and PCBA examination
Battery inspection capabilities
Electronic component inspection versatility
Automated features reducing operator workload
Intuitive user interface minimizing training time
Customizable settings for specific requirements
Large inspection area for varied sample sizes
Specifications
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