X-ray systems for Semiconductor
The XSCAN-H series offers three high-powered X-ray inspection systems (H130-OCT, H160-OCT, and H160M) featuring hybrid 2D/3D inspection capabilities with automation technology, designed for comprehensive electronic component inspection with tube powers ranging from 130kV/39W to 160kV/10W, incorporating advanced OCT technology for precise measurements.
XSCAN-H series Features
Across All Models:
- Basic 7-axis control system (X1,Y1, X2, Y2, Z, T, R1)
- Large inspection area (330 x 330mm / 525 x 540mm)
- Navigation user interface with auto teaching
- Various measuring tool software
- Easy-to-use operation system
- Optional cone beam CT capability
- 5″ flat panel detector
Model-Specific Features
XSCAN-H130-OCT:
- 130kV/39W x-ray tube power
- Closed type/5μm focal spot
- 1700 x 1700 x 1800mm dimensions
- 3000kg weight
XSCAN-H160-OCT & H160M:
- 160kV/10W x-ray tube power
- Open type/1μm focal spot
- 1700 x 1700 x 2200mm dimensions
- 3400kg weight
- H160M offers image intensifier option
XSCAN-A series Benefits
- Ideal for SMT assemblies inspection
- Effective semiconductor component analysis
- Comprehensive PCB and PCBA examination
- Battery inspection capabilities
- Electronic component inspection versatility
- Automated features reducing operator workload
- Intuitive user interface minimizing training time
- Customizable settings for specific requirements
- Large inspection area for varied sample sizes
